About Zhanyang
Leading Semiconductor Precision Manufacturing. Your Sustainable Partner for Quality Excellence.
Zhanyang Precision Industrial Co., Ltd. (Zhanyang Precision) has been dedicated to the design, manufacturing, and precision machining of semiconductor process-critical components, molds, and fixtures since its establishment in 1998. With a strong commitment to quality, precision, and reliability, we provide customized solutions that meet the demanding requirements of the semiconductor industry.
As the semiconductor industry continues to evolve from conventional packaging technologies to advanced packaging solutions such as CoWoS, SoIC, 3D IC, and heterogeneous integration, Zhanyang Precision continuously invests in advanced manufacturing equipment, precision metrology systems, and engineering capabilities. Today, we are recognized as a trusted partner in Taiwan's precision manufacturing and semiconductor supply chain.
Integrated Design x Precision Manufacturing x Advanced Materials
Zhanyang Precision offers comprehensive engineering and manufacturing solutions by integrating:
β Custom Design & Engineering
β Ultra-Precision Machining
β Advanced Material Processing
Our expertise covers a wide range of semiconductor manufacturing applications, including:
β CoWoS (Chip-on-Wafer-on-Substrate)
β SoIC (System on Integrated Chips)
β FOPLP (Fan-Out Panel Level Packaging)
β Die Saw / Wafer Dicing
β Die Bonding
β Wire Bonding
Through continuous innovation and precision engineering, Zhanyang Precision is committed to delivering high-performance, high-reliability semiconductor components that help customers improve yield, enhance process stability, and accelerate technological advancement.
Company Milestones
| Year | Event |
|---|---|
| 1998 | Foundation | Zhanyang Precision Industrial Co., Ltd. Established Entered the precision machining industry, laying the foundation for manufacturing semiconductor process-critical components. |
| 2000 | Automation Upgrade | Implementation of CNC and Automation Equipment Enhanced machining accuracy and production stability, advancing toward high-efficiency manufacturing. |
| 2005 | Process Transformation | Transition from Conventional Machining to Automated Manufacturing Comprehensively optimized milling and grinding processes to strengthen precision machining capabilities. |
| 2006 | Quality Enhancement | Introduction of High-Precision Metrology Systems Established a reliable quality inspection framework to ensure product consistency and manufacturing excellence. |
| 2009 | Technological Breakthrough | Implementation of EDM (Electrical Discharge Machining) Technology Expanded capabilities in manufacturing complex and high-precision components. |
| 2011 | Capacity Expansion | Expansion of Second and Third Manufacturing Facilities Significantly increased production capacity and delivery capabilities. |
| 2012 | Metrology Upgrade | Upgraded from 2D to 2.5D Vision Measurement Technology Enhanced precision inspection capabilities to support increasingly demanding manufacturing requirements. |
| 2013 | Industry Recognition | Awarded Outstanding Supplier Recognition Officially became part of the semiconductor supply chain ecosystem. |
| 2019 | Quality Certification | Certified to ISO 9001:2015 Established an internationally recognized quality management system. |
| 2021 | Smart Manufacturing | Introduction of Advanced Metrology Systems and New CNC Equipment Achieved micron-level machining capabilities and improved process stability. |
| 2021β2022 | Talent Development | Promotion of iPAS Professional Certification Programs Strengthened semiconductor talent cultivation and technical knowledge transfer. |
| 2022 | Prestigious Achievement | Recipient of the Taichung Golden Hand Award Recognized for excellence and innovation in precision manufacturing technology. |
| 2024 | Sustainability Transformation | Implementation of ISO 14064 and Renewable Energy Certifications Advancing ESG initiatives and low-carbon manufacturing practices. |
| 2025 | Talent Excellence | Selected as an iPAS Benchmark Enterprise Further strengthened industry-academia collaboration and workforce development. |
| 2026 | International Standards Deployment | Implementation of ISO 27001, ISO 14001, and ISO 45001 Systems Enhancing information security, environmental management, and occupational health & safety governance. |
| 2028 | Future Expansion | Launch of the New Caotun Manufacturing Campus (13,550 m²) Establishing a next-generation manufacturing base dedicated to semiconductor precision components and advanced process solutions. |
