ZHANYANG PRECISION GLOBAL CO., LTD. | Semiconductor Precision Parts and Advanced Packaging Fixtures
Founded in 1998, Zhanyang Precision specializes in the design and manufacturing of precision semiconductor components, fixtures, molds, and wafer process carriers. Serving advanced packaging applications including CoWoS, SoIC, FOPLP, Die Saw, Die Bond, and Wire Bond, we integrate ultra-precision machining, advanced material processing, nano-coating, and mirror polishing to deliver high-performance solutions. With expertise in ceramics, quartz, tungsten carbide, copper, and specialty alloys, Zhanyang helps customers improve yield, process stability, and manufacturing efficiency. Ultra-precision machining, hard and brittle material processing, nano-coating and mirror polishing are combined in Taichung, Taiwan to supply Die Bond, Wire Bond, Die Saw and advanced packaging production lines.
Precision Semiconductor Experts
Zhanyang specializes in custom semiconductor precision components, tooling, fixtures, and advanced packaging solutions, delivering high-precision manufacturing, reliable quality, and fast lead times.
Packaging Core Components
Ejector Pin SetCustom semiconductor packaging components engineered to enhance process accuracy, equipment performance, and manufacturing yield.
Precision Molds & Fixtures
Customized Fixtures / ToolingHigh-precision molds and fixtures designed for semiconductor packaging processes, ensuring repeatability and operational stability.
Wafer Dicing Carriers
Wafer Frame CarriersAdvanced wafer dicing carriers and cassettes developed to protect wafers and improve handling efficiency throughout production.
Advanced Material Machining
Hard Brittle Material MachiningSpecialized machining capabilities for ceramics, quartz, tungsten carbide, and advanced materials requiring micron-level precision.
One-Stop Custom Solutions
We provide one-stop services from design and material selection to CNC precision machining, assembly, and validation.
Micron-Level Machining
Our advanced machining capabilities achieve micron-level precision, ensuring exceptional accuracy, consistency, and reliability.
Higher Yield, Lower Cost
High-quality components improve yield, boost equipment stability, reduce costs, and strengthen competitiveness.