Choosing Between Packaging Tooling, Equipment Parts and Wafer Carriers

The range divides into five groups: semiconductor packaging tooling such as ceramic and quartz molds, tungsten carbide punches and trimming, deflashing and lead-forming dies; process-critical parts for Die Bond and Wire Bond equipment including ejector pin sets, bond tools, heater blocks and clamp plates; hard and brittle material machining; wafer process carriers; and custom machining services covering AlSiC, laser micro-drilling and anti-adhesion treatment.

Selection normally starts from the machine platform and the process step rather than the part name, because the same function is built in different formats depending on temperature, cleanliness and wear conditions. Packaging tooling and equipment parts are ordered against a specific bonder, wire bonder, dicing saw or inspection station model, wafer process carriers are ordered against wafer size, and the custom machining group handles geometries that fall outside those four families.