Advancing Semiconductor Process Innovation and Workforce Development

Zhanyang Precision Joins iPAS Talent Sustainability Forum

The iPAS Talent Sustainability Forum (iPAS Future Pass), jointly organized by Taiwan’s Ministry of Economic Affairs, Ministry of Labor, and Industrial Technology Research Institute (ITRI), was successfully held in Taichung. Under the theme “Talent Leadership, Smart Sustainability,” the forum brought together representatives from industry, government, and academia to discuss semiconductor talent development, advanced manufacturing processes, and the future of smart manufacturing.

As a specialized manufacturer dedicated to precision semiconductor process components and customized tooling solutions, Zhanyang Precision participated in this industry dialogue to explore the future integration of semiconductor talent cultivation and process technology development. With the rapid advancement of advanced packaging technologies such as CoWoS, SoIC, and 3D IC, manufacturing facilities face increasingly stringent requirements for high-precision tooling, fixtures, and process stability, while simultaneously driving strong demand for highly skilled technical professionals.

During the forum, industry experts highlighted that the rapid growth of Artificial Intelligence (AI), High-Performance Computing (HPC), and Automotive Electronics have accelerated the semiconductor industry's transition into a highly technology-intensive era. Companies now require not only advanced equipment and process upgrades but also professionals with expertise in precision manufacturing, process integration, and problem-solving capabilities. The iPAS certification system serves as a critical bridge between industry and talent, helping companies efficiently identify and recruit professionals with practical, industry-relevant skills.

Zhanyang Precision has long been committed to the development of key components and precision fixtures for semiconductor packaging processes, including Die Bonding, Wire Bonding, Molding, Trim & Form, as well as Wafer Dicing applications. Through advanced capabilities in high-precision CNC machining, ceramic machining, and ultra-precision grinding technologies, the company helps customers enhance process stability and improve manufacturing yields. In terms of talent development, Zhanyang continues to support industry-academia collaboration and actively promotes knowledge transfer and workforce development through participation in industry initiatives.

The forum featured keynote presentations and executive panel discussions covering topics such as semiconductor process optimization, smart manufacturing, automation equipment integration, and sustainable talent development strategies. The event also fostered collaboration and knowledge exchange between enterprises, research institutions, and academic organizations.

Zhanyang stated that it will continue to strengthen its investment in high-precision semiconductor components, customized manufacturing solutions, and advanced process technologies, while actively participating in industry talent development programs. By working closely with industry, government, and academic partners, Zhanyang aims to help build a globally competitive semiconductor ecosystem and support customers in maintaining leadership within advanced manufacturing processes and international markets.