To help customers improve process stability and packaging yield, Zhanyang implemented a multi-stage ejection mechanism combined with high-precision mechanical calibration technology, successfully enhancing ultra-thin die handling performance and yield.

Process Pain Points and Engineering Challenges

In high-precision Die Bonding processes, ultra-thin dies (≤3 mil) are extremely sensitive to force distribution during die pick-up due to their minimal thickness. The customer's existing CM700 die bonder utilized a conventional single-stage ejector pin design, which often caused localized stress concentration during ejection, resulting in die cracking and unstable pick-up performance.

In addition, high-aspect-ratio dies (2:1) are prone to uneven force distribution during pick-up, leading to die shifting and pick-up failures, which further impact Die Bond yield and equipment stability. As advanced packaging continues to move toward higher density and miniaturization, traditional ejector mechanisms can no longer meet the requirements of high-precision packaging and high-yield mass production.

Solution

To address ultra-thin die handling challenges, Zhanyang implemented a Multi-Stage Ejector Mechanism, replacing the conventional single-stage design with a staged ejection approach that significantly reduces the risk of die cracking caused by sudden stress concentration. Through controlled multi-stage motion, stress is gradually released during the ejection process, resulting in smoother die separation and improved handling stability. This solution is particularly suitable for ultra-thin dies and high-precision Die Pick-Up applications.

In addition, Zhanyang optimized the cam eccentric profile (Cam Optimization Design) through precision mechanical engineering and motion simulation analysis. This enhancement improves dynamic stability during the ejection process, ensuring smoother and more consistent die pick-up performance.

To further enhance mechanical precision, comprehensive alignment and geometric calibration were performed, including ejector pin height consistency, spindle perpendicularity, and linear guide parallelism adjustments. These improvements ensure long-term precision, stability, and reliable operation after machine retrofit.

Process Validation

● Equipment: CM700 Die Bonder
● Application: Ultra-Thin Dies (Thin Chip ≤3 mil)
● Process: Die Bond / Pick & Place
● Validation Items: Pick-up stability, die cracking rate, equipment repeatability, and long-term operational stability
Through actual production trials and extended process validation, the multi-stage ejector mechanism was proven to effectively improve ultra-thin die handling performance and overall process stability.

Test Results

After implementing the multi-stage ejector assembly and precision mechanical calibration, the customer achieved significant improvements in ultra-thin die handling performance:
● Significantly improved Die Pick-Up yield
● Substantial reduction in die cracking
● Enhanced equipment stability and repeatability
● Improved force distribution for high-aspect-ratio dies

Successfully improving Die Bond process stability and advanced packaging production quality.

Case Study Summary

This project successfully resolved ultra-thin die handling yield challenges through a Multi-Stage Ejector Pin Design and Precision Mechanical Alignment Technology, significantly improving Die Bond process stability and packaging yield.

Leveraging its expertise in precision machining, mechanical design, and process optimization integration, Zhanyang continues to help customers overcome high-precision and high-yield challenges in advanced packaging applications, serving as a trusted technology partner for semiconductor process upgrades and equipment optimization.