CoWoS, SoIC and FOPLP Packaging Applications | Zhanyang

Founded in 1998, Zhanyang Precision specializes in the design and manufacturing of precision semiconductor components, fixtures, molds, and wafer process carriers. Serving advanced packaging applications including CoWoS, SoIC, FOPLP, Die Saw, Die Bond, and Wire Bond, we integrate ultra-precision machining, advanced material processing, nano-coating, and mirror polishing to deliver high-performance solutions. With expertise in ceramics, quartz, tungsten carbide, copper, and specialty alloys, Zhanyang helps customers improve yield, process stability, and manufacturing efficiency. Application pages cover CoWoS 2.5D integration, SoIC 3D stacking, FOPLP panel level packaging, Die Saw wafer dicing and conventional Die Bond, Wire Bond, molding and trim and form packaging.

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CoWoS, SoIC, FOPLP and Die Saw Process Applications

Process Requirements, Tooling Support and Component Qualification by Application

Application

ZhanYang specializes in the design and manufacturing of critical semiconductor components, precision tooling, and customized fixtures. Our solutions support a wide range of semiconductor packaging processes, including Die Bonding, Wire Bonding, Wafer Dicing, and Trim & Form, as well as advanced packaging technologies such as CoWoS, SoIC, FOPLP, Flip Chip, and 3D IC.

By integrating precision CNC machining, ceramic machining, EDM, ultra-precision grinding and polishing, and micron-level precision control, we provide Bond Tools, Ejector Pins, Heating Stages, Clamps, Wafer Carriers, and customized fixtures. Based on specific equipment interfaces, materials, and process requirements, ZhanYang delivers integrated engineering support from precision component manufacturing and fixture design to process optimization, helping customers improve process stability, production yield, and manufacturing efficiency for next-generation AI, HPC, HBM, automotive electronics, and advanced semiconductor packaging applications.

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Result 1 - 5 of 5

Tooling and Component Requirements Across CoWoS, SoIC, FOPLP and Die Saw

Each application places a different demand on the tooling. CoWoS 2.5D integration on a silicon interposer concentrates power density across multiple dies, so the bond tool contact specification and heater stage thermal uniformity dominate. SoIC chip-to-chip and chip-to-wafer stacking moves the constraint to nanometre-scale alignment and bonding stability, while FOPLP shifts it again to large-area flatness and panel warpage control.

Die Saw and wafer dicing depend instead on carrier rigidity and cleanliness, which is why wafer frames, cassettes and vacuum chucks are matched to wafer size and to the automation that loads them. Conventional Die Bond, Wire Bond, molding, deflash and trim and form lines use ejector pin sets, clamp plates, molds and punches selected for wear life and material stability at the running temperature.

Zhanyang specializes in semiconductor precision components, custom molds, and fixture manufacturing for semicon processes. We also provide ceramic machining and precision polishing solutions.

One-Stop Custom Solutions

One-Stop Custom Solutions

We provide one-stop services from design and material selection to CNC precision machining, assembly, and validation.

Micron-Level Machining

Micron-Level Machining

Our advanced machining capabilities achieve micron-level precision, ensuring exceptional accuracy, consistency, and reliability.

Higher Yield, Lower Cost

Higher Yield, Lower Cost

High-quality components improve yield, boost equipment stability, reduce costs, and strengthen competitiveness.